Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects
10.1088/0957-4484/18/30/305306
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sg-nus-scholar.10635-975022023-10-26T09:02:15Z Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects Sharma, G. Chong, C.S. Ebin, L. Kripesh, V. Gan, C.L. Sow, C.H. PHYSICS 10.1088/0957-4484/18/30/305306 Nanotechnology 18 30 - NNOTE 2014-10-16T09:36:01Z 2014-10-16T09:36:01Z 2007-08-08 Article Sharma, G., Chong, C.S., Ebin, L., Kripesh, V., Gan, C.L., Sow, C.H. (2007-08-08). Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects. Nanotechnology 18 (30) : -. ScholarBank@NUS Repository. https://doi.org/10.1088/0957-4484/18/30/305306 09574484 http://scholarbank.nus.edu.sg/handle/10635/97502 000247619200006 Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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ScholarBank@NUS |
| description |
10.1088/0957-4484/18/30/305306 |
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PHYSICS |
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PHYSICS Sharma, G. Chong, C.S. Ebin, L. Kripesh, V. Gan, C.L. Sow, C.H. |
| format |
Article |
| author |
Sharma, G. Chong, C.S. Ebin, L. Kripesh, V. Gan, C.L. Sow, C.H. |
| spellingShingle |
Sharma, G. Chong, C.S. Ebin, L. Kripesh, V. Gan, C.L. Sow, C.H. Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects |
| author_sort |
Sharma, G. |
| title |
Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects |
| title_short |
Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects |
| title_full |
Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects |
| title_fullStr |
Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects |
| title_full_unstemmed |
Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects |
| title_sort |
patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/97502 |
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1781786684468232192 |