Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects

• Main Authors: Sharma, G., Chong, C.S., Ebin, L., Kripesh, V., Gan, C.L., Sow, C.H.
• Other Authors: PHYSICS
• Format: Article
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/97502
• Institution: National University of Singapore

10.1088/0957-4484/18/30/305306