Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding

• المؤلف الرئيسي: Lee, Teck Kheng
• مؤلفون آخرون: Wong Chee Cheong
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Manufacturing
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/5272

A new joint-in-via architecture has been developed with an instantaneous fluxless bonding know as SLICF (solid-liquid interdiffusion bonding by compressive force) for fine pitch microelectronic packaging. The SLICF bonding utilises a mechanical force to break the Sn oxide layer and allows the submer...