Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding
A new joint-in-via architecture has been developed with an instantaneous fluxless bonding know as SLICF (solid-liquid interdiffusion bonding by compressive force) for fine pitch microelectronic packaging. The SLICF bonding utilises a mechanical force to break the Sn oxide layer and allows the submer...
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| 格式: | Theses and Dissertations |
| 出版: |
2008
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| 在線閱讀: | https://hdl.handle.net/10356/5272 |
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| 機構: | Nanyang Technological University |
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