Board level bend test and viscoelastic warpage study of IC packages
This project aimed to address two main concerns in the production of electronics packages. These include the packages' warpage performance after the assembly processes and board level solder joints' reliability during their service life.
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| Format: | Theses and Dissertations |
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2008
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| Online Access: | http://hdl.handle.net/10356/5303 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-53032023-03-11T17:09:37Z Board level bend test and viscoelastic warpage study of IC packages Toh, Siew Khim. Zhong, Zhaowei School of Mechanical and Production Engineering Tee, Tong Yan DRNTU::Engineering::Manufacturing This project aimed to address two main concerns in the production of electronics packages. These include the packages' warpage performance after the assembly processes and board level solder joints' reliability during their service life. Master of Science (Mechanics & Processing of Materials) 2008-09-17T10:47:21Z 2008-09-17T10:47:21Z 2003 2003 Thesis http://hdl.handle.net/10356/5303 Nanyang Technological University application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| topic |
DRNTU::Engineering::Manufacturing |
| spellingShingle |
DRNTU::Engineering::Manufacturing Toh, Siew Khim. Board level bend test and viscoelastic warpage study of IC packages |
| description |
This project aimed to address two main concerns in the production of electronics packages. These include the packages' warpage performance after the assembly processes and board level solder joints' reliability during their service life. |
| author2 |
Zhong, Zhaowei |
| author_facet |
Zhong, Zhaowei Toh, Siew Khim. |
| format |
Theses and Dissertations |
| author |
Toh, Siew Khim. |
| author_sort |
Toh, Siew Khim. |
| title |
Board level bend test and viscoelastic warpage study of IC packages |
| title_short |
Board level bend test and viscoelastic warpage study of IC packages |
| title_full |
Board level bend test and viscoelastic warpage study of IC packages |
| title_fullStr |
Board level bend test and viscoelastic warpage study of IC packages |
| title_full_unstemmed |
Board level bend test and viscoelastic warpage study of IC packages |
| title_sort |
board level bend test and viscoelastic warpage study of ic packages |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/5303 |
| _version_ |
1761781991428063232 |