Board level bend test and viscoelastic warpage study of IC packages

This project aimed to address two main concerns in the production of electronics packages. These include the packages' warpage performance after the assembly processes and board level solder joints' reliability during their service life.

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Bibliographic Details
Main Author: Toh, Siew Khim.
Other Authors: Zhong, Zhaowei
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5303
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Institution: Nanyang Technological University
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