Surface and subsurface damage investigation and CFD modeling of CMP for optical silicon substrate
Precision optics and photonic applications using silicon substrates nowadays demand high production efficiency with nano-level surface quality and shallow sub-surface damage. Modem machining technologies need to evolve further to not only improve surface quality but also subsurface morphology. In th...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2013
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/53144 |
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