Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
Modern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environment in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is bec...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | https://hdl.handle.net/10356/5368 |
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| Institution: | Nanyang Technological University |
| Summary: | Modern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environment in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is becoming an increasingly important aspect of the reliability of electronic products. And shock analysis and corresponding protection methods are quite meaningful to the development of electronic products. Thus, the objective of this work is to realize quick drop-impact analysis of packaged electronic products. |
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