Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards

Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards

Modern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environment in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is bec...

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Main Author: Wang, Yuqi
Other Authors: Low Kin Huat
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing::Product engineering
Online Access:https://hdl.handle.net/10356/5368
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-5368
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spelling sg-ntu-dr.10356-53682023-03-11T18:07:14Z Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards Wang, Yuqi Low Kin Huat School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing::Product engineering Modern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environment in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is becoming an increasingly important aspect of the reliability of electronic products. And shock analysis and corresponding protection methods are quite meaningful to the development of electronic products. Thus, the objective of this work is to realize quick drop-impact analysis of packaged electronic products. DOCTOR OF PHILOSOPHY (MAE) 2008-09-17T10:49:00Z 2008-09-17T10:49:00Z 2008 2008 Thesis Wang, Y. (2008). Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/5368 10.32657/10356/5368 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing::Product engineering
spellingShingle DRNTU::Engineering::Manufacturing::Product engineering
Wang, Yuqi
Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
description Modern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environment in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is becoming an increasingly important aspect of the reliability of electronic products. And shock analysis and corresponding protection methods are quite meaningful to the development of electronic products. Thus, the objective of this work is to realize quick drop-impact analysis of packaged electronic products.
author2 Low Kin Huat
author_facet Low Kin Huat
Wang, Yuqi
format Theses and Dissertations
author Wang, Yuqi
author_sort Wang, Yuqi
title Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
title_short Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
title_full Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
title_fullStr Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
title_full_unstemmed Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
title_sort drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
publishDate 2008
url https://hdl.handle.net/10356/5368
_version_ 1761781458311053312

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