Study of low temperature plasma activated wafer bonding

• 主要作者: Yeo, Thomas Peng Siong.
• 其他作者: Yoon Soon Fatt
• 格式: Final Year Project
• 語言: English
• 出版: 2013
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics; DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
• 在線閱讀: http://hdl.handle.net/10356/54210

A 2-inch GaAs and Si were bonded via Argon (Ar) plasma activation. The effects brought by plasma parameters of exposure time, pressure and radio-frequency (RF) power were investigated through statistical means and characterization tools such as Atomic Force Microscopy (AFM) and Video Contact Angle S...