Copper wire bond crack characterization after temperature cycling and correlation with accelerated test (thermal shock)

• Main Author: Liew, Li Ping.
• Other Authors: Tan Cher Ming
• Format: Final Year Project
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: http://hdl.handle.net/10356/54445
• Institution: Nanyang Technological University

There are more than 8 to 9 billion wires bonded every year on average in the planet and more than 160 billion Integrated Chips (ICs) produced went through wire bonding process. With the increased use of wire bonding and extensive infrastructure for chipinterconnection on wire bonding, more...