Process development for PECVD equipment

Process for depositing silicon nitride film by using Micro-90011 PECVD system has been developed. The stress test structure simulation, fabrication and system performance improvement have been studied in the project. The studies are carried out stress measurements at a device level by using micromac...

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Bibliographic Details
Main Author:	Yang, Jian Jun
Other Authors:	Miao, Jianmin
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing::Production management
Online Access:	http://hdl.handle.net/10356/5448
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5448
record_format	dspace
spelling	sg-ntu-dr.10356-54482023-03-11T16:57:07Z Process development for PECVD equipment Yang, Jian Jun Miao, Jianmin School of Mechanical and Production Engineering Ilisecu, Ciprian DRNTU::Engineering::Manufacturing::Production management Process for depositing silicon nitride film by using Micro-90011 PECVD system has been developed. The stress test structure simulation, fabrication and system performance improvement have been studied in the project. The studies are carried out stress measurements at a device level by using micromachined structure. The results can be applied for PECVD deposited silicon nitride film for MEMS device design. A typical, applicable circular and rotation structure was successful fabricated. Master of Science (Precision Engineering) 2008-09-17T10:50:52Z 2008-09-17T10:50:52Z 2003 2003 Thesis http://hdl.handle.net/10356/5448 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing::Production management
spellingShingle	DRNTU::Engineering::Manufacturing::Production management Yang, Jian Jun Process development for PECVD equipment
description	Process for depositing silicon nitride film by using Micro-90011 PECVD system has been developed. The stress test structure simulation, fabrication and system performance improvement have been studied in the project. The studies are carried out stress measurements at a device level by using micromachined structure. The results can be applied for PECVD deposited silicon nitride film for MEMS device design. A typical, applicable circular and rotation structure was successful fabricated.
author2	Miao, Jianmin
author_facet	Miao, Jianmin Yang, Jian Jun
format	Theses and Dissertations
author	Yang, Jian Jun
author_sort	Yang, Jian Jun
title	Process development for PECVD equipment
title_short	Process development for PECVD equipment
title_full	Process development for PECVD equipment
title_fullStr	Process development for PECVD equipment
title_full_unstemmed	Process development for PECVD equipment
title_sort	process development for pecvd equipment
publishDate	2008
url	http://hdl.handle.net/10356/5448
_version_	1761781569831305216

Process development for PECVD equipment

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