Process development for PECVD equipment
Process for depositing silicon nitride film by using Micro-90011 PECVD system has been developed. The stress test structure simulation, fabrication and system performance improvement have been studied in the project. The studies are carried out stress measurements at a device level by using micromac...
Saved in:
Main Author: | Yang, Jian Jun |
---|---|
Other Authors: | Miao, Jianmin |
Format: | Theses and Dissertations |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/5448 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Concurrent product development for oil field exploration equipment
by: Ang, Toon Hua
Published: (2008) -
Development of a workflow management system prototype to support internet-based product development processes
by: Zheng, Yong Wei.
Published: (2008) -
Development of a micro-accretion process for three dimensional structures
by: Choo, Jian Huei.
Published: (2008) -
Development of a step-based process planning application protocol for PCB assembly
by: Lim, Jit Hai.
Published: (2009) -
Process and reliability studies of solder bumping using eutectic sn/pb solder
by: Lo, Marvin Chen Yang.
Published: (2008)