Direct liquid cooling of stacked multichip modules
In this dissertation, the experimental and numerical results for a direct single-phase liquid cooling scheme are presented.
Saved in:
Main Author: | Chen, Xuyang. |
---|---|
Other Authors: | Toh, Kok Chuan |
Format: | Theses and Dissertations |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/5489 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Cost modeling of multichip modules substrates technology in concurrent engineering
by: Mok, Mun Fai.
Published: (2009) -
Thermal modelling of integrated liquid cooling solutions for 3D stacked silicon modules
by: Sin, Kai Chieh.
Published: (2009) -
System design and characterisation of integrated liquid cooling solutions for 3D-stacked modules
by: Tan, Siow Pin
Published: (2009) -
Multichip modules technology : its relevance in the Singapore context.
by: Fong, Hin Sing., et al.
Published: (2009) -
Integrated liquid cooling systems for 3-D stacked TSV modules
by: Tang, G.Y., et al.
Published: (2014)