Development of indexing clamper mechanism for wire bonder

• Main Author: Zhang, Yue.
• Other Authors: Huang, Weimin
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/5543
• Institution: Nanyang Technological University

For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. On the other hand, for horizontal LED (light emitting diode), like TO-92, the market price is as cheap as only US 1 cent due to the intensive commercial competition. The output of wire bonder must be more than 12,000 units per hour so that the semiconductor fabricator can achieve financial balance. To satisfy both the precision and efficiency requirements from semiconductor manufacturers, the indexing clampers of wire bonders face an even bigger challenge. It is somehow critical for the mechanical design to fulfill the latest requirements. It is well known that we must stay in tune with the roadmap. Failure to catch up means surrendering the market share to the competitors. To keep up the pace, we must develop wire bonder continuously. The clamping force of indexing should be kept as constant as possible with the thickness of device as a variable.