Development of indexing clamper mechanism for wire bonder

• Main Author: Zhang, Yue.
• Other Authors: Huang, Weimin
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/5543
• Institution: Nanyang Technological University

For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. On the other hand, for horizontal LED (light emitting diode), like TO-92, the market price is as cheap as only US 1 cent...