Transient thermal behavior of electronics chips during accidental loss of pumping power
Both steady state and transient experiments are performed to study the heat transfer characteristics on an array of four in-line simulated, flush-mounted electronics chips in a vertical rectangular channel.
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2008
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sg-ntu-dr.10356-55602023-03-11T17:04:34Z Transient thermal behavior of electronics chips during accidental loss of pumping power Zheng, Yingjun. Tou, Stephen Kwok Woon School of Mechanical and Production Engineering Tso, Chih Ping DRNTU::Engineering::Mechanical engineering Both steady state and transient experiments are performed to study the heat transfer characteristics on an array of four in-line simulated, flush-mounted electronics chips in a vertical rectangular channel. Master of Engineering (MPE) 2008-09-17T10:53:38Z 2008-09-17T10:53:38Z 2001 2001 Thesis http://hdl.handle.net/10356/5560 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Mechanical engineering Zheng, Yingjun. Transient thermal behavior of electronics chips during accidental loss of pumping power |
description |
Both steady state and transient experiments are performed to study the heat transfer characteristics on an array of four in-line simulated, flush-mounted electronics chips in a vertical rectangular channel. |
author2 |
Tou, Stephen Kwok Woon |
author_facet |
Tou, Stephen Kwok Woon Zheng, Yingjun. |
format |
Theses and Dissertations |
author |
Zheng, Yingjun. |
author_sort |
Zheng, Yingjun. |
title |
Transient thermal behavior of electronics chips during accidental loss of pumping power |
title_short |
Transient thermal behavior of electronics chips during accidental loss of pumping power |
title_full |
Transient thermal behavior of electronics chips during accidental loss of pumping power |
title_fullStr |
Transient thermal behavior of electronics chips during accidental loss of pumping power |
title_full_unstemmed |
Transient thermal behavior of electronics chips during accidental loss of pumping power |
title_sort |
transient thermal behavior of electronics chips during accidental loss of pumping power |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/5560 |
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1761781856537149440 |