Transient thermal behavior of electronics chips during accidental loss of pumping power
Both steady state and transient experiments are performed to study the heat transfer characteristics on an array of four in-line simulated, flush-mounted electronics chips in a vertical rectangular channel.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5560 |
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| Institution: | Nanyang Technological University |