Transient thermal behavior of electronics chips during accidental loss of pumping power

• Main Author: Zheng, Yingjun.
• Other Authors: Tou, Stephen Kwok Woon
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/5560
• Institution: Nanyang Technological University

Both steady state and transient experiments are performed to study the heat transfer characteristics on an array of four in-line simulated, flush-mounted electronics chips in a vertical rectangular channel.