Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading
This project investigates the influences of the different methods of analysis in implementing thermal cyclic loading on the stress and strain responses in the flip-chip solder joints.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5633 |
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| Institution: | Nanyang Technological University |
| Summary: | This project investigates the influences of the different methods of analysis in implementing thermal cyclic loading on the stress and strain responses in the flip-chip solder joints. |
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