Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading

This project investigates the influences of the different methods of analysis in implementing thermal cyclic loading on the stress and strain responses in the flip-chip solder joints.

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Bibliographic Details
Main Author:	Chong, Yok Rue.
Other Authors:	Pang, John Hock Lye
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/5633
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5633
record_format	dspace
spelling	sg-ntu-dr.10356-56332023-03-11T17:41:06Z Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading Chong, Yok Rue. Pang, John Hock Lye School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This project investigates the influences of the different methods of analysis in implementing thermal cyclic loading on the stress and strain responses in the flip-chip solder joints. Master of Engineering (MPE) 2008-09-17T10:55:25Z 2008-09-17T10:55:25Z 2001 2001 Thesis http://hdl.handle.net/10356/5633 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Chong, Yok Rue. Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading
description	This project investigates the influences of the different methods of analysis in implementing thermal cyclic loading on the stress and strain responses in the flip-chip solder joints.
author2	Pang, John Hock Lye
author_facet	Pang, John Hock Lye Chong, Yok Rue.
format	Theses and Dissertations
author	Chong, Yok Rue.
author_sort	Chong, Yok Rue.
title	Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading
title_short	Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading
title_full	Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading
title_fullStr	Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading
title_full_unstemmed	Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading
title_sort	finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading
publishDate	2008
url	http://hdl.handle.net/10356/5633
_version_	1761781915528986624

Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading

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