Variable frequency microwave (VFM) curing for PBGA and FSBGA packages

This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process.

Saved in:
Bibliographic Details
Main Author: Chua, Riwis Ian Ping.
Other Authors: Pang, John Hock Lye
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5646
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
id sg-ntu-dr.10356-5646
record_format dspace
spelling sg-ntu-dr.10356-56462023-03-11T17:20:26Z Variable frequency microwave (VFM) curing for PBGA and FSBGA packages Chua, Riwis Ian Ping. Pang, John Hock Lye School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process. Master of Science (Mechanics & Processing of Materials) 2008-09-17T10:55:44Z 2008-09-17T10:55:44Z 2002 2002 Thesis http://hdl.handle.net/10356/5646 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Chua, Riwis Ian Ping.
Variable frequency microwave (VFM) curing for PBGA and FSBGA packages
description This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process.
author2 Pang, John Hock Lye
author_facet Pang, John Hock Lye
Chua, Riwis Ian Ping.
format Theses and Dissertations
author Chua, Riwis Ian Ping.
author_sort Chua, Riwis Ian Ping.
title Variable frequency microwave (VFM) curing for PBGA and FSBGA packages
title_short Variable frequency microwave (VFM) curing for PBGA and FSBGA packages
title_full Variable frequency microwave (VFM) curing for PBGA and FSBGA packages
title_fullStr Variable frequency microwave (VFM) curing for PBGA and FSBGA packages
title_full_unstemmed Variable frequency microwave (VFM) curing for PBGA and FSBGA packages
title_sort variable frequency microwave (vfm) curing for pbga and fsbga packages
publishDate 2008
url http://hdl.handle.net/10356/5646
_version_ 1761781935365947392