Variable frequency microwave (VFM) curing for PBGA and FSBGA packages

This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process.

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Bibliographic Details
Main Author: Chua, Riwis Ian Ping.
Other Authors: Pang, John Hock Lye
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5646
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Institution: Nanyang Technological University
Description
Summary:This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process.