Variable frequency microwave (VFM) curing for PBGA and FSBGA packages
This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process.
محفوظ في:
| المؤلف الرئيسي: | |
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| مؤلفون آخرون: | |
| التنسيق: | Theses and Dissertations |
| منشور في: |
2008
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://hdl.handle.net/10356/5646 |
| الوسوم: |
إضافة وسم
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| المؤسسة: | Nanyang Technological University |
| الملخص: | This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process. |
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