Optimization of wire bond process for yield improvement with ball grid array

• المؤلف الرئيسي: Foo, Chiu Peng.
• مؤلفون آخرون: Lam, Yee Cheong
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Manufacturing
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/5710
• المؤسسة: Nanyang Technological University

The objective of this project was to improve the process yield of Ball Grid Array (BGA) packages. Preliminary analysis indicated that 42.2% of the yield losses during the wire bonding of BGA packages was due to Non-stick on Pad (NSOP). The main focus of this project was to optimise the processing pa...