Optimization of wire bond process for yield improvement with ball grid array

The objective of this project was to improve the process yield of Ball Grid Array (BGA) packages. Preliminary analysis indicated that 42.2% of the yield losses during the wire bonding of BGA packages was due to Non-stick on Pad (NSOP). The main focus of this project was to optimise the processing pa...

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Bibliographic Details
Main Author: Foo, Chiu Peng.
Other Authors: Lam, Yee Cheong
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5710
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Institution: Nanyang Technological University
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