Chip on flex and flip chip on flex technology

The outline of this project is to look at the design concept, material review and the process capabilities and requirements for the COF and manufacturing. Various problems pertaining to the reliability of the COF assemblies at the various stages of the processes have also been highlighted. In the wi...

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Bibliographic Details
Main Author:	Goh, Kay Soon.
Other Authors:	Zhong, Zhaowei
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/5747
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5747
record_format	dspace
spelling	sg-ntu-dr.10356-57472023-03-11T16:54:01Z Chip on flex and flip chip on flex technology Goh, Kay Soon. Zhong, Zhaowei School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing The outline of this project is to look at the design concept, material review and the process capabilities and requirements for the COF and manufacturing. Various problems pertaining to the reliability of the COF assemblies at the various stages of the processes have also been highlighted. In the wire bonding process, substrate material variations, such as the gold lead surface roughness and the present of contamination have been cited as major reliability issues, which will affect the process consistency and reliability of the bonded wires. Such phenomena are clearly shown by the various scanning electron microscope (SEM) photographs. In addition, the presence of voids during encapsulation and after cure can result in mechanical failures when subjected to the various reliability tests. Various experiments have been carried out to characterize and optimize the various parameters for product reliability. Master of Science 2008-09-17T10:58:05Z 2008-09-17T10:58:05Z 1999 1999 Thesis http://hdl.handle.net/10356/5747 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Goh, Kay Soon. Chip on flex and flip chip on flex technology
description	The outline of this project is to look at the design concept, material review and the process capabilities and requirements for the COF and manufacturing. Various problems pertaining to the reliability of the COF assemblies at the various stages of the processes have also been highlighted. In the wire bonding process, substrate material variations, such as the gold lead surface roughness and the present of contamination have been cited as major reliability issues, which will affect the process consistency and reliability of the bonded wires. Such phenomena are clearly shown by the various scanning electron microscope (SEM) photographs. In addition, the presence of voids during encapsulation and after cure can result in mechanical failures when subjected to the various reliability tests. Various experiments have been carried out to characterize and optimize the various parameters for product reliability.
author2	Zhong, Zhaowei
author_facet	Zhong, Zhaowei Goh, Kay Soon.
format	Theses and Dissertations
author	Goh, Kay Soon.
author_sort	Goh, Kay Soon.
title	Chip on flex and flip chip on flex technology
title_short	Chip on flex and flip chip on flex technology
title_full	Chip on flex and flip chip on flex technology
title_fullStr	Chip on flex and flip chip on flex technology
title_full_unstemmed	Chip on flex and flip chip on flex technology
title_sort	chip on flex and flip chip on flex technology
publishDate	2008
url	http://hdl.handle.net/10356/5747
_version_	1761781591236935680

Chip on flex and flip chip on flex technology

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