Chip on flex and flip chip on flex technology
The outline of this project is to look at the design concept, material review and the process capabilities and requirements for the COF and manufacturing. Various problems pertaining to the reliability of the COF assemblies at the various stages of the processes have also been highlighted. In the wi...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5747 |
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| Institution: | Nanyang Technological University |