Development of a flip-chip composite interconnection system
The objective of this research is to develop a novel flip-chip composite interconnect structure to overcome the inherent weaknesses of the conventional solder bump interconnection. In the conventional flip-chip, 3-D stacking of chips is often not feasible due to the inherent solder bump collapse dur...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2012
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| Online Access: | https://hdl.handle.net/10356/49500 |
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| Institution: | Nanyang Technological University |
| Language: | English |