Development of a flip-chip composite interconnection system
The objective of this research is to develop a novel flip-chip composite interconnect structure to overcome the inherent weaknesses of the conventional solder bump interconnection. In the conventional flip-chip, 3-D stacking of chips is often not feasible due to the inherent solder bump collapse dur...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2012
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/49500 |
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