Development of a flip-chip composite interconnection system

• Main Author: Wong, Stephen Chee Khuen
• Other Authors: Pang Hock Lye, John
• Format: Theses and Dissertations
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Mechanical engineering::Mechatronics
• Online Access: https://hdl.handle.net/10356/49500
• Institution: Nanyang Technological University

The objective of this research is to develop a novel flip-chip composite interconnect structure to overcome the inherent weaknesses of the conventional solder bump interconnection. In the conventional flip-chip, 3-D stacking of chips is often not feasible due to the inherent solder bump collapse dur...