Electrolessly-plated ternary nickel alloys as metallization materials for lead-free soldering

• Main Author: Yang, Ying
• Other Authors: Chen Zhong
• Format: Theses and Dissertations
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• Online Access: https://hdl.handle.net/10356/59235
• Institution: Nanyang Technological University

To address the potential reliability challenges brought by the accelerated reaction with the adoption of lead-free solders, three electrolessly-plated ternary Ni-based metallizations (Ni-Sn-P, Ni-W-P and Ni-Co-P) were developed as the soldering metallization in this work. The interfacial reactions b...