Electrolessly-plated ternary nickel alloys as metallization materials for lead-free soldering

To address the potential reliability challenges brought by the accelerated reaction with the adoption of lead-free solders, three electrolessly-plated ternary Ni-based metallizations (Ni-Sn-P, Ni-W-P and Ni-Co-P) were developed as the soldering metallization in this work. The interfacial reactions b...

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Bibliographic Details
Main Author: Yang, Ying
Other Authors: Chen Zhong
Format: Theses and Dissertations
Language:English
Published: 2014
Subjects:
Online Access:https://hdl.handle.net/10356/59235
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Institution: Nanyang Technological University
Language: English

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