Finite element analysis on overall mechanical properties of molding compounds in electronic packaging

Finite element analysis on overall mechanical properties of molding compounds in electronic packaging

In this thesis, effective elastic moduli of molding compound materials in plastic electronic packages were investigated. The materials are composed of epoxy matrix and silica fillers. Since it is quite difficult to analyze three-dimensional multi-inclusion interaction problems by Finite Element Meth...

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Main Author: Leong, Sook Har.
Other Authors: Xiao, Zhongmin
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Electronic packaging materials
Online Access:http://hdl.handle.net/10356/5964
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-5964
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spelling sg-ntu-dr.10356-59642023-03-11T17:04:56Z Finite element analysis on overall mechanical properties of molding compounds in electronic packaging Leong, Sook Har. Xiao, Zhongmin School of Mechanical and Production Engineering DRNTU::Engineering::Materials::Electronic packaging materials In this thesis, effective elastic moduli of molding compound materials in plastic electronic packages were investigated. The materials are composed of epoxy matrix and silica fillers. Since it is quite difficult to analyze three-dimensional multi-inclusion interaction problems by Finite Element Method (FEM), where as the conclusions of two-dimensional problems are revelatory to three-dimensional problems, composites composed of a matrix and unidirectional aligned fibers or inclusions modeled as two-dimensional plane strain problems, are analyzed by FEM. Master of Engineering (MPE) 2008-09-17T11:03:45Z 2008-09-17T11:03:45Z 2000 2000 Thesis http://hdl.handle.net/10356/5964 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Materials::Electronic packaging materials
spellingShingle DRNTU::Engineering::Materials::Electronic packaging materials
Leong, Sook Har.
Finite element analysis on overall mechanical properties of molding compounds in electronic packaging
description In this thesis, effective elastic moduli of molding compound materials in plastic electronic packages were investigated. The materials are composed of epoxy matrix and silica fillers. Since it is quite difficult to analyze three-dimensional multi-inclusion interaction problems by Finite Element Method (FEM), where as the conclusions of two-dimensional problems are revelatory to three-dimensional problems, composites composed of a matrix and unidirectional aligned fibers or inclusions modeled as two-dimensional plane strain problems, are analyzed by FEM.
author2 Xiao, Zhongmin
author_facet Xiao, Zhongmin
Leong, Sook Har.
format Theses and Dissertations
author Leong, Sook Har.
author_sort Leong, Sook Har.
title Finite element analysis on overall mechanical properties of molding compounds in electronic packaging
title_short Finite element analysis on overall mechanical properties of molding compounds in electronic packaging
title_full Finite element analysis on overall mechanical properties of molding compounds in electronic packaging
title_fullStr Finite element analysis on overall mechanical properties of molding compounds in electronic packaging
title_full_unstemmed Finite element analysis on overall mechanical properties of molding compounds in electronic packaging
title_sort finite element analysis on overall mechanical properties of molding compounds in electronic packaging
publishDate 2008
url http://hdl.handle.net/10356/5964
_version_ 1761781917621944320

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