Finite element analysis on overall mechanical properties of molding compounds in electronic packaging
In this thesis, effective elastic moduli of molding compound materials in plastic electronic packages were investigated. The materials are composed of epoxy matrix and silica fillers. Since it is quite difficult to analyze three-dimensional multi-inclusion interaction problems by Finite Element Meth...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5964 |
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| Institution: | Nanyang Technological University |