Development of carbon nanotubes for interconnects and nano-packaging applications

• المؤلف الرئيسي: Yap, Ray Chin Chong
• مؤلفون آخرون: Tay Beng Kang
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/61597

As the scaling in CMOS technology is nearing its limits, the new scaling trend emphasize on making chips smaller, with higher performance and more functionality. This is putting a huge demand on the backend packaging modules, and the industries are now looking at the various challenges faced at the...