Development of carbon nanotubes for interconnects and nano-packaging applications
As the scaling in CMOS technology is nearing its limits, the new scaling trend emphasize on making chips smaller, with higher performance and more functionality. This is putting a huge demand on the backend packaging modules, and the industries are now looking at the various challenges faced at the...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2014
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/61597 |
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| 機構: | Nanyang Technological University |
| 語言: | English |
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