Reduced temperature electrical measurement of semiconductor devices
This report introduce the research status of thermoelectric cooling on semiconductors such as diode and semiconductor wafer. Measurement of current-voltage characteristic of semiconductor diodes by applying thermoelectric cooling device to determine how temperature affects its quality and operation....
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sg-ntu-dr.10356-638162023-07-07T16:45:01Z Reduced temperature electrical measurement of semiconductor devices Ang, Derrick Jia Hao Wong Kin Shun, Terence School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering This report introduce the research status of thermoelectric cooling on semiconductors such as diode and semiconductor wafer. Measurement of current-voltage characteristic of semiconductor diodes by applying thermoelectric cooling device to determine how temperature affects its quality and operation. In addition, experiments are conducted on epitaxial silicon-germanium wafers on hot plate and by applying thermoelectric cooling device to determine the effect of thermal dissipation using Fourier’s law to show the effect of thermoelectric cooling. Measurement results and findings of the experiments will be discussed in detail in this report. Bachelor of Engineering 2015-05-19T05:22:19Z 2015-05-19T05:22:19Z 2015 2015 Final Year Project (FYP) http://hdl.handle.net/10356/63816 en Nanyang Technological University 65 p. application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
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Singapore Singapore |
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NTU Library |
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English |
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DRNTU::Engineering::Electrical and electronic engineering |
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DRNTU::Engineering::Electrical and electronic engineering Ang, Derrick Jia Hao Reduced temperature electrical measurement of semiconductor devices |
| description |
This report introduce the research status of thermoelectric cooling on semiconductors such as diode and semiconductor wafer. Measurement of current-voltage characteristic of semiconductor diodes by applying thermoelectric cooling device to determine how temperature affects its quality and operation. In addition, experiments are conducted on epitaxial silicon-germanium wafers on hot plate and by applying thermoelectric cooling device to determine the effect of thermal dissipation using Fourier’s law to show the effect of thermoelectric cooling. Measurement results and findings of the experiments will be discussed in detail in this report. |
| author2 |
Wong Kin Shun, Terence |
| author_facet |
Wong Kin Shun, Terence Ang, Derrick Jia Hao |
| format |
Final Year Project |
| author |
Ang, Derrick Jia Hao |
| author_sort |
Ang, Derrick Jia Hao |
| title |
Reduced temperature electrical measurement of semiconductor devices |
| title_short |
Reduced temperature electrical measurement of semiconductor devices |
| title_full |
Reduced temperature electrical measurement of semiconductor devices |
| title_fullStr |
Reduced temperature electrical measurement of semiconductor devices |
| title_full_unstemmed |
Reduced temperature electrical measurement of semiconductor devices |
| title_sort |
reduced temperature electrical measurement of semiconductor devices |
| publishDate |
2015 |
| url |
http://hdl.handle.net/10356/63816 |
| _version_ |
1772826168616026112 |