Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs
In this project, a new carrier has been proposed via using simple springs to provide the pressurized guide-ring to improve the overall uniformity at a very much affordable cost. The first prototype uses polyphenylene sulfide (PPS) as the material for the rotating carrier. The second prototype uses c...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6436 |
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| Institution: | Nanyang Technological University |