Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs

Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs

In this project, a new carrier has been proposed via using simple springs to provide the pressurized guide-ring to improve the overall uniformity at a very much affordable cost. The first prototype uses polyphenylene sulfide (PPS) as the material for the rotating carrier. The second prototype uses c...

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Main Author: Tan, Chek Soon.
Other Authors: Zhong, Zhaowei
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing
Online Access:http://hdl.handle.net/10356/6436
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-6436
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spelling sg-ntu-dr.10356-64362023-03-11T17:23:25Z Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs Tan, Chek Soon. Zhong, Zhaowei School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing In this project, a new carrier has been proposed via using simple springs to provide the pressurized guide-ring to improve the overall uniformity at a very much affordable cost. The first prototype uses polyphenylene sulfide (PPS) as the material for the rotating carrier. The second prototype uses ceramics as the carrier's material. Master of Science (Precision Engineering) 2008-09-17T11:14:54Z 2008-09-17T11:14:54Z 2003 2003 Thesis http://hdl.handle.net/10356/6436 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Tan, Chek Soon.
Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs
description In this project, a new carrier has been proposed via using simple springs to provide the pressurized guide-ring to improve the overall uniformity at a very much affordable cost. The first prototype uses polyphenylene sulfide (PPS) as the material for the rotating carrier. The second prototype uses ceramics as the carrier's material.
author2 Zhong, Zhaowei
author_facet Zhong, Zhaowei
Tan, Chek Soon.
format Theses and Dissertations
author Tan, Chek Soon.
author_sort Tan, Chek Soon.
title Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs
title_short Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs
title_full Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs
title_fullStr Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs
title_full_unstemmed Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs
title_sort improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs
publishDate 2008
url http://hdl.handle.net/10356/6436
_version_ 1761781309379706880

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