Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)

• المؤلف الرئيسي: Wu, Hong Ying.
• مؤلفون آخرون: Zhu, Weiguang
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/3766

CMP plays a very important role to realize multi-level metallization which is dependent on the ability to effectively planarize the dielectric layers, which insulate the multi-level interconnects. Despite this advantage, the process still suffer from large global non-uniformity within a die and acro...