Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)

Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)

CMP plays a very important role to realize multi-level metallization which is dependent on the ability to effectively planarize the dielectric layers, which insulate the multi-level interconnects. Despite this advantage, the process still suffer from large global non-uniformity within a die and acro...

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Main Author: Wu, Hong Ying.
Other Authors: Zhu, Weiguang
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Online Access:http://hdl.handle.net/10356/3766
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-3766
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spelling sg-ntu-dr.10356-37662023-07-04T15:53:55Z Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP) Wu, Hong Ying. Zhu, Weiguang School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Semiconductors CMP plays a very important role to realize multi-level metallization which is dependent on the ability to effectively planarize the dielectric layers, which insulate the multi-level interconnects. Despite this advantage, the process still suffer from large global non-uniformity within a die and across a wafer or between wafers. Master of Science (Microelectronics) 2008-09-17T09:37:04Z 2008-09-17T09:37:04Z 2002 2002 Thesis http://hdl.handle.net/10356/3766 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Wu, Hong Ying.
Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)
description CMP plays a very important role to realize multi-level metallization which is dependent on the ability to effectively planarize the dielectric layers, which insulate the multi-level interconnects. Despite this advantage, the process still suffer from large global non-uniformity within a die and across a wafer or between wafers.
author2 Zhu, Weiguang
author_facet Zhu, Weiguang
Wu, Hong Ying.
format Theses and Dissertations
author Wu, Hong Ying.
author_sort Wu, Hong Ying.
title Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)
title_short Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)
title_full Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)
title_fullStr Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)
title_full_unstemmed Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)
title_sort improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (cmp)
publishDate 2008
url http://hdl.handle.net/10356/3766
_version_ 1772828692405288960

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