Characterisation of the temperature and time dependent mechanical properties and solder

Eutectic 63Sn-37Pb solder is commonly used as interconnects in SMT electronic packages. Characterisation of the temperature and time dependent properties of eutectic solder is necessary in understanding solder joint reliability. The effect of thermal cycling ageing on solder joint mechanical propert...

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Bibliographic Details
Main Author: Tan, Kwang Hong.
Other Authors: Pang, John Hock Lye
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/6475
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Institution: Nanyang Technological University