Characterisation of the temperature and time dependent mechanical properties and solder
Eutectic 63Sn-37Pb solder is commonly used as interconnects in SMT electronic packages. Characterisation of the temperature and time dependent properties of eutectic solder is necessary in understanding solder joint reliability. The effect of thermal cycling ageing on solder joint mechanical propert...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6475 |
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| Institution: | Nanyang Technological University |
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