Characterisation of the temperature and time dependent mechanical properties and solder

Eutectic 63Sn-37Pb solder is commonly used as interconnects in SMT electronic packages. Characterisation of the temperature and time dependent properties of eutectic solder is necessary in understanding solder joint reliability. The effect of thermal cycling ageing on solder joint mechanical propert...

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Bibliographic Details
Main Author:	Tan, Kwang Hong.
Other Authors:	Pang, John Hock Lye
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/6475
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-6475
record_format	dspace
spelling	sg-ntu-dr.10356-64752023-03-11T17:27:20Z Characterisation of the temperature and time dependent mechanical properties and solder Tan, Kwang Hong. Pang, John Hock Lye School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing Eutectic 63Sn-37Pb solder is commonly used as interconnects in SMT electronic packages. Characterisation of the temperature and time dependent properties of eutectic solder is necessary in understanding solder joint reliability. The effect of thermal cycling ageing on solder joint mechanical properties and residual fatigue strength requires research attention. This report documents the investigation conducted on the determination of the mechanical properties of bulk solder specimens, the microstructural and mechanical response of solder after subjecting reflowed solder joint to thermal cycling ageing from -40°C to 125°C. Master of Engineering (MPE) 2008-09-17T11:15:57Z 2008-09-17T11:15:57Z 2000 2000 Thesis http://hdl.handle.net/10356/6475 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Tan, Kwang Hong. Characterisation of the temperature and time dependent mechanical properties and solder
description	Eutectic 63Sn-37Pb solder is commonly used as interconnects in SMT electronic packages. Characterisation of the temperature and time dependent properties of eutectic solder is necessary in understanding solder joint reliability. The effect of thermal cycling ageing on solder joint mechanical properties and residual fatigue strength requires research attention. This report documents the investigation conducted on the determination of the mechanical properties of bulk solder specimens, the microstructural and mechanical response of solder after subjecting reflowed solder joint to thermal cycling ageing from -40°C to 125°C.
author2	Pang, John Hock Lye
author_facet	Pang, John Hock Lye Tan, Kwang Hong.
format	Theses and Dissertations
author	Tan, Kwang Hong.
author_sort	Tan, Kwang Hong.
title	Characterisation of the temperature and time dependent mechanical properties and solder
title_short	Characterisation of the temperature and time dependent mechanical properties and solder
title_full	Characterisation of the temperature and time dependent mechanical properties and solder
title_fullStr	Characterisation of the temperature and time dependent mechanical properties and solder
title_full_unstemmed	Characterisation of the temperature and time dependent mechanical properties and solder
title_sort	characterisation of the temperature and time dependent mechanical properties and solder
publishDate	2008
url	http://hdl.handle.net/10356/6475
_version_	1761781841427169280

Characterisation of the temperature and time dependent mechanical properties and solder

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