Design analysis of data links in 2.5DICs

• Main Author: Visamangalam Thattai Lakshminarayanan
• Other Authors: Kim Tae Hyoung
• Format: Theses and Dissertations
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
• Online Access: http://hdl.handle.net/10356/64813
• Institution: Nanyang Technological University

As the trend of device integration moves from VLSI to ULSI, number of problems have arisen for 3 dimensional integration of ICs with TSV technology. The increasing complexity and number of components on the substrate is expected to rise faster before Nano-technology takes over. 2.5DICs are...