Design analysis of data links in 2.5DICs
As the trend of device integration moves from VLSI to ULSI, number of problems have arisen for 3 dimensional integration of ICs with TSV technology. The increasing complexity and number of components on the substrate is expected to rise faster before Nano-technology takes over. 2.5DICs are...
Saved in:
主要作者: | |
---|---|
其他作者: | |
格式: | Theses and Dissertations |
語言: | English |
出版: |
2015
|
主題: | |
在線閱讀: | http://hdl.handle.net/10356/64813 |
標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
成為第一個發表評論!