Design analysis of data links in 2.5DICs

As the trend of device integration moves from VLSI to ULSI, number of problems have arisen for 3 dimensional integration of ICs with TSV technology. The increasing complexity and number of components on the substrate is expected to rise faster before Nano-technology takes over. 2.5DICs are...

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Bibliographic Details
Main Author: Visamangalam Thattai Lakshminarayanan
Other Authors: Kim Tae Hyoung
Format: Theses and Dissertations
Language:English
Published: 2015
Subjects:
Online Access:http://hdl.handle.net/10356/64813
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Institution: Nanyang Technological University
Language: English

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