Design analysis of data links in 2.5DICs

• المؤلف الرئيسي: Visamangalam Thattai Lakshminarayanan
• مؤلفون آخرون: Kim Tae Hyoung
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2015
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/64813

As the trend of device integration moves from VLSI to ULSI, number of problems have arisen for 3 dimensional integration of ICs with TSV technology. The increasing complexity and number of components on the substrate is expected to rise faster before Nano-technology takes over. 2.5DICs are...