Enhancement of flow boiling using 3D printed porous structures

With the ever-increasing density and compactness of microprocessors on a chip, the heat generated by these electronic units rises along. The rate of heat dissipation has become a limiting factor in the performance of the chips and hence, it is of vital importance that efforts in searching for effect...

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Main Author: Wang, Yawei
Other Authors: Leong Kai Choong
Format: Final Year Project
Language:English
Published: 2016
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Online Access:http://hdl.handle.net/10356/65859
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-658592023-03-04T18:48:41Z Enhancement of flow boiling using 3D printed porous structures Wang, Yawei Leong Kai Choong School of Mechanical and Aerospace Engineering DRNTU::Engineering::Aeronautical engineering With the ever-increasing density and compactness of microprocessors on a chip, the heat generated by these electronic units rises along. The rate of heat dissipation has become a limiting factor in the performance of the chips and hence, it is of vital importance that efforts in searching for effective methods of cooling continue so that the electronic components could be used to their maximum capacity. In this project, an experimental investigation was carried out to study the effect of coolant mass flux, porous structure modification and unit cell size of substrate on flow boiling heat transfer. Experiments were conducted on five different substrates of three distinct structures fabricated by 3D printing, which function as the heat sink. During each experiment, the substrate was inserted in a rectangular evaporator channel where heat was channelled vertically upwards with the use of dielectric coolant FC-72 for testing. The mass flux was varied from 6.5 to 13.5 kg/m2·s corresponding to the range of flow rate from 0.3 to 0.6 L/min while the heat flux was altered from 5.5 to 74.5 W/cm2. For each experiment, the wall temperature and coolant pressure were monitored, recorded and analysed to obtain the superheat and heat transfer coefficient of flow boiling at various heat power settings. From the experimental results, a higher coolant mass flux was seen to enhance heat transfer for both the empty channel and porous substrates tested to varying extents. Compared to the empty channel, all three porous structures improved cooling performance with "Spherical", "Octet" and "Dope" achieving 55.8%, 44.2% and 27.2% enhancement, respectively. Substrates with unit cell size 10 mm outperformed their ii counterparts of the same structure but of smaller unit cell size 5 mm by 10.0% and 4.5% for "Octet" and "Dope", respectively. The effect due to unit cell size was not as significant as other factors such as coolant mass flux and structure modification. Bachelor of Engineering (Aerospace Engineering) 2016-01-04T01:54:24Z 2016-01-04T01:54:24Z 2015 2015 Final Year Project (FYP) http://hdl.handle.net/10356/65859 en Nanyang Technological University 72 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Aeronautical engineering
spellingShingle DRNTU::Engineering::Aeronautical engineering
Wang, Yawei
Enhancement of flow boiling using 3D printed porous structures
description With the ever-increasing density and compactness of microprocessors on a chip, the heat generated by these electronic units rises along. The rate of heat dissipation has become a limiting factor in the performance of the chips and hence, it is of vital importance that efforts in searching for effective methods of cooling continue so that the electronic components could be used to their maximum capacity. In this project, an experimental investigation was carried out to study the effect of coolant mass flux, porous structure modification and unit cell size of substrate on flow boiling heat transfer. Experiments were conducted on five different substrates of three distinct structures fabricated by 3D printing, which function as the heat sink. During each experiment, the substrate was inserted in a rectangular evaporator channel where heat was channelled vertically upwards with the use of dielectric coolant FC-72 for testing. The mass flux was varied from 6.5 to 13.5 kg/m2·s corresponding to the range of flow rate from 0.3 to 0.6 L/min while the heat flux was altered from 5.5 to 74.5 W/cm2. For each experiment, the wall temperature and coolant pressure were monitored, recorded and analysed to obtain the superheat and heat transfer coefficient of flow boiling at various heat power settings. From the experimental results, a higher coolant mass flux was seen to enhance heat transfer for both the empty channel and porous substrates tested to varying extents. Compared to the empty channel, all three porous structures improved cooling performance with "Spherical", "Octet" and "Dope" achieving 55.8%, 44.2% and 27.2% enhancement, respectively. Substrates with unit cell size 10 mm outperformed their ii counterparts of the same structure but of smaller unit cell size 5 mm by 10.0% and 4.5% for "Octet" and "Dope", respectively. The effect due to unit cell size was not as significant as other factors such as coolant mass flux and structure modification.
author2 Leong Kai Choong
author_facet Leong Kai Choong
Wang, Yawei
format Final Year Project
author Wang, Yawei
author_sort Wang, Yawei
title Enhancement of flow boiling using 3D printed porous structures
title_short Enhancement of flow boiling using 3D printed porous structures
title_full Enhancement of flow boiling using 3D printed porous structures
title_fullStr Enhancement of flow boiling using 3D printed porous structures
title_full_unstemmed Enhancement of flow boiling using 3D printed porous structures
title_sort enhancement of flow boiling using 3d printed porous structures
publishDate 2016
url http://hdl.handle.net/10356/65859
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