Enhancement of flow boiling using 3D printed porous structures
With the ever-increasing density and compactness of microprocessors on a chip, the heat generated by these electronic units rises along. The rate of heat dissipation has become a limiting factor in the performance of the chips and hence, it is of vital importance that efforts in searching for effect...
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| 格式: | Final Year Project |
| 語言: | English |
| 出版: |
2016
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| 在線閱讀: | http://hdl.handle.net/10356/65859 |
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| 機構: | Nanyang Technological University |
| 語言: | English |