Enhancement of flow boiling using 3D printed porous structures

• Main Author: Wang, Yawei
• Other Authors: Leong Kai Choong
• Format: Final Year Project
• Language: English
• Published: 2016
• Subjects: DRNTU::Engineering::Aeronautical engineering
• Online Access: http://hdl.handle.net/10356/65859
• Institution: Nanyang Technological University

With the ever-increasing density and compactness of microprocessors on a chip, the heat generated by these electronic units rises along. The rate of heat dissipation has become a limiting factor in the performance of the chips and hence, it is of vital importance that efforts in searching for effect...