Enhancement of flow boiling using 3D printed porous structures

• المؤلف الرئيسي: Wang, Yawei
• مؤلفون آخرون: Leong Kai Choong
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2016
• الموضوعات: DRNTU::Engineering::Aeronautical engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/65859
• المؤسسة: Nanyang Technological University

With the ever-increasing density and compactness of microprocessors on a chip, the heat generated by these electronic units rises along. The rate of heat dissipation has become a limiting factor in the performance of the chips and hence, it is of vital importance that efforts in searching for effect...